Automatic CVL & EMI Bonding Machine with Double planform
DCB3060
Category：
Automation equipment
DESCRIPTION
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Technical Parameters |
Name: Automatic CVL & EMI Bonding Machine with Double planform |
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Model: DCB3060 |
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FPC |
Maximum fit range |
305×600mm |
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Thickness |
0.05~0.5mm |
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Applicable type |
Double panel, single panel, multilayer board |
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FPC loading and unloading |
Robot automatic loading and unloading |
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Cover film |
Maximum applicable fit specifications |
Max.260 x 500mm |
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Minimum thickness |
0.025mm |
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Fitting head |
Quantity |
lea |
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Fit the platform |
Quantity |
2ea |
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Fitting efficiency |
4 points Markc <6 seconds/piece (not including manipulator, loading and unloading and pressing curing time) |
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2 points Markc <5 seconds/piece (not including manipulator, loading and unloading and pressing curing time) |
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Repeated motion accuracy of equipment |
±0.02mm(FPC shrinkage rate <0.1mm, cover film shrinkage rate <0.1mm) |
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Heating type |
Laminating head heating/platform heating: ~160℃ |
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Dimensions |
2750 (W)x2250(D)x2100(H)mm (including FFU) |
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Weight |
~3500Kg |
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Keywords：
MESSAGES
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